Problem:
Fixtures, guides and tooling that hold and position printed circuit boards during the flow solder process are not handled gently. The boards are cleaned with high speed nylon brushes and an alkaline solution, then rinsed twice before entering a highly corrosive flux bath. A major problem is the build-up of solder on equipment that contaminates the flux and solder baths which in turn slows production and adds costs.

Solution:
MAGNAPLATE HCR was used to coat the solder fixtures, guides and tooling, providing a combination of extremely high corrosion resistance and surface hardness.